slider-inner

TBM 230 / TBM 240

Scantech’s TBM microwave moisture analysers use proven technology successfully implemented in hundreds of installations in many commodities over decades, continuously refined and improved through successive generations of advancements in hardware and software.

Microwaves are transmitted through the process material to the receiver. The technology is not affected by segregation, as the microwaves pass through all the material and measurements are independent of material size and flow rate.

TBM 230 is the standalone option and TBM 240 is the model used when integrated with other analysers and therefore does not require its own enclosure.

Advantages of the TBM 230 / 240 low frequency microwave systems including:

  • Continuous, full material thickness analysis,
  • Proven, reliable and short customised calibration process,
  • Lower frequencies provide superior performance (over high frequency systems) in certain materials under certain conditions, e.g. deeper beds, higher attenuating materials,
  • Adjustable frame to cater for bed depths to 800mm,
  • Compensates for varying flow rates,
  • Robust frame mounts to conveyor structure, clamp-on frame option avoids drilling,
  • No contact with the conveyor belt or process material,
  • Stainless steel frame and enclosure options, remote cabinet option.

Case study: Major iron ore companies have assessed moisture analysers on the market and found TBM 230 to be successful in most applications compared to other products that are difficult to calibrate. TBM 230 is being used by most leading iron ore companies.

"Online measuring methods are indispensable for process control in cement factories."

Joachim Harder OneStone Consulting Group 2011

Conferences

The 2nd European Green Steel Summit 2024 – Dusseldorf, Germany 13/03/2024

Angelica Ayala from Scantech will be attending the summit... Read More

2024 ISRI Convention and Expo – Las Vegas, USA 15/04/2024

Meet Vivek Naidoo at the Scantech Booth (#904) at the Expo.. Read More

AISTech 2024 – Columbus, USA 07/05/2024

Meet Henry Kurth and Ryan Khoo at the Scantech Booth (#1302).. Read More

View All Conferences